Laser transmission bonding of silicon with titanium and copper layer for wafer-level packaging

Pennington, N. J / ECS (2012) [Contribution to a book, Contribution to a conference proceedings]

222nd ECS Meeting: 2012 Fall Meeting of ECSJ ; PRiME 2012 ; Honolulu, HI, October 7-12, 2012 / ECS, Electrochemical Society of Japan
Page(s): 189-198

Authors

Authors

Wissinger, Ansgar
Schmitz, Moritz
Olowinsky, Alexander
Gillner, Arnold
Poprawe, Reinhart

Identifier

  • REPORT NUMBER: RWTH-CONV-189285