Study on the thermal load of the laser impulse metal bonding process to the metallized thermal sensitive substrate

Chung, W.-S. (Corresponding author); Nagel, F.; Olowinsky, A.; Gillner, A.

Heidelberg : Springer (2020, 2021)
Journal Article

In: Welding in the world
Volume: 65
Issue: 3
Page(s)/Article-Nr.: 463-474